Materials and processes for meta optical elements (MOE)


  • A comprehensive suite of materials for patterning, pattern transfer (etch hard masks) and post etch removers
  • The suite of materials have been demonstrated for wide selection of substrates. Etch process recommendations are available
  • Gap fill and planarizing materials for high AR structures
  • Optical coatings and adhesives
  • Wafer bonding materials
Modern lens of smartphone camera structure

Why meta optics?

Meta optics is a technology which enables novel approaches to optical devices. To these include higher level of integration, combination of several optical functions to a single element, and new wafer level packaging. This novel technology also enables new optical sensing possibilities through additional degrees of freedom in optical design.


Key benefits of our approach

The technology, processes and materials we have developed permit

  • Improved pattern fidelity
  • Improved yield
  • Long term optical performance
  • Decoupling of pattering and optical performance


Benefits of the pattern transfer and etching of the substrate

Decoupling of the lithography and optical functional layers results in more freedom to optimize each layer and step separately. In this way optical performance is not limited e.g. by high refractive index imprintable materials.

Freedom to choose optical layers with high quality, high refractive index (e.g. low scattering, no yellowing) without residues of imprintable solutions. Pattern with precision to gain high yield and a cost benefit. Utilize advanced pattern transfer layers (hard masks ) to obtain high aspect ratio structures.


We manufacture unique electronic materials that run the world.

We are an innovative materials company with strong R&D capabilities and a portfolio of unique patents. We are one of the only European suppliers of EUV lithography materials. Pibond’s materials have been adopted in the latest semiconductor devices globally. We enable, simplify, and increase the quality and performance of semiconductor and photonics devices.

Delivery Process

PiBond offers turn-key service from optical design to delivery of final components. We start with a feasibility analysis and modeling of the optical wave fronts. This is followed by a mask design and component fabrication. Finally, characterisation and singulation are carried out.



  • Silicon (Si)
  • Gallium Nitride (GaN)
  • Fused Quartz (SiO2)
  • High index glass

Nanoimprinting (NIL) and lithography with etch transfer layers

Using nanoimprinting and photolithography as patterning methods. Pattern is transferred to the substrate or functional layer using oxygen (O2) or fluorine (F) / chlorine (Cl) based plasma etching of the etch transfer layers. Final structure can be overcoated if needed.


Materials and material engineering


PiBond’s materials are selected based on the substrate that could be e.g. glass, silicon or GaN.

Functional layer

A functional layer, like TiO2, a-Si, Si3N4 or polymer, is fabricated on substrate.


PiBond has engineered both organic (OTL-series) and silicon based (SH-series) masks that can be etched with either Oxygen or Fluorine, respectively, based gases. Etch-selectivity properties enable structures with high aspect-ratios.


PiBond has selected organic and silicon based (in-organic) nanoimprint resists for UV or thermal hardening. Also photolithography pattering is possible.


After etching, the masking layers must be stripped. PiBond has a selection of both TMAH and non-TMAH based strippers to keep the substrates and functional layers untouched when optimally removing all residues.

AR-coating and overcoating

PiBond has designed a wide of range index-matching dielectrics for various substrates and wavelengths (SC-series).