PiBond Advanced Materials for Optical Sensors, MEMS and IC Packaging at NEPCON in JapanJan 1st 2016
Tokyo Big Sight, January 13-15, 2016 – Nepcon Japan 2016.
PiBond participates in the NEPCON conference at Nagase booths E52-40 (Hall 6) and E21-13 (Hall 3). We exhibit our solutions for 3D IC and packaging. Similarly, our optical dielectrics and materials for MEMS manufacturing are showcased. We welcome participants to learn PiBond’s technological solutions for these applications.
The products featured are:
SAP hard mask products for aggressive etches
The optical dielectrics of our SC Products with a refractive index range of 1.25 – 1.9
Organosiloxane dielectrics for microelectronics - SG Products