PiBond exhibits at SEMICON China 2018Feb 23rd 2018
Shanghai New International Expo Centre, March 14-16, 2018
PiBond will participate in SEMICON China event in Shanghai. You can find us at the Genes Tech booth No. 1677 in hall N1 and at the PacTech-Packaging Technologies booth No. 2409 in hall N2. PiBond exhibits products from all its product lines. We welcome all conference participants to visit us to learn of our spin coatable dielectrics and pattern transfer products.