PiBond Expands Espoo Facility to Meet Growing Demand for Lithography ProductsJan 31st 2024

PiBond, a leading specialty chemical manufacturer serving the semiconductor industry, is set to undergo a substantial expansion of its current facility in Espoo, Finland, to enhance lithography product production. The capacity expansion, scheduled for 2024, is expected to lead to a 50% increase in production capacity, positioning PiBond to meet rising demand and significantly boost sales in the semiconductor industry in the coming years.

The expansion targets the growing market demand for lithography products, supporting the volume production needed for microprocessors, memory chips, sensors, and displays. PiBond's commitment to ultra-purity involves separating the manufacturing processes for silicon and carbon-based products, aligning with the highest industry standards.

Pasi Leinonen, Senior Director of Sales and Marketing at PiBond, stated: "With this strategic investment, PiBond is poised to play a crucial role in meeting the increasing demand for lithography products in the semiconductor industry. We are dedicated to advancing technology and supporting our customers with high-value specialty materials."

The expanded facility not only strengthens PiBond's production capabilities but also facilitates the implementation of new manufacturing processes on a larger scale, showcasing the company's commitment to innovation and staying at the forefront of technological advancements.

Leinonen added: "This expansion marks a new chapter in PiBond's growth story, solidifying its position as a leading supplier of high-value specialty materials in a rapidly growing and evolving industry."

In a global semiconductor market projected to reach $624 billion this year (Gartner) and expected to double to $1300 billion within this decade, PiBond stands out as an innovative force.

For media inquiries, please contact:

Pasi Leinonen, Senior Director, Sales & Marketing



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