PiBond materials for MEMS, TSV and IC fabrication at SEMICON ChinaMar 10th 2016

Shanghai New International Expo Centre, March 15-17, 2016 – SEMICON China 2016.

PiBond participates in SEMICON China event in Shanghai at the Nagase booth No. 9 at the location N5-538. We exhibit our SAP product solutions for TSV fabrication, MEMS manufacturing as well as IC packaging. Similarly, our optical dielectrics are showcased. We welcome all conference participants, and particularly exhibitors and visitors and IC manufacturing pavilions, to visit us and Nagase to learn of new material solutions which can improve processes and simultaneously decrease cost of ownership.

The products featured are:

  • SAP hard mask products for aggressive etches

  • The optical dielectrics of our SC Products with a refractive index range of 1.25 – 1.9 available at several different thickness formulations

  • Organosiloxane dielectrics for microelectronics - SG Products  

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