PiBond materials for MEMS, TSV and IC fabrication at SEMICON EuropaOct 25th 2016
Alpexpo, Grenoble, October 25-27, 2016 – SEMICON Europa.
PiBond participates in SEMICON Europa event in Grenoble, France. Our booth No. is 541. We exhibit our SAP product solutions for TSV fabrication, MEMS manufacturing as well as IC packaging. Similarly, our optical dielectrics are showcased. We welcome participants to learn PiBond’s technological solutions for these applications.
The products featured are:
SAP hard mask products for aggressive etches
The optical dielectrics of our SC Products with a refractive index range of 1.25 – 1.9
Organosiloxane dielectrics for microelectronics - SG Products