PiBond materials for MEMS, TSV and IC fabrication at SEMICON TaiwanSep 7th 2016
Taipei Nangang Exhibition Center, September 7-9, 2016 – SEMICON Taiwan 2016.
PiBond participates in SEMICON Taiwan event in Taipei at the Grand Trend booth No. 773. We exhibit our SAP product solutions for TSV fabrication, MEMS manufacturing as well as IC packaging. Similarly, our optical dielectrics are showcased. We welcome all conference participants to visit us and Grand Trend to learn of new material solutions which can improve processes and simultaneously decrease cost of ownership.
The products featured are:
SAP hard mask products for aggressive etches
The optical dielectrics of our SC Products with a refractive index range of 1.25 – 1.9
Organosiloxane dielectrics for microelectronics - SG Products