• Etch and pattern transfer hard mask materials based on silicon, metal and carbon chemistries
  • Speciality resist supplier – silicon and metal based resists for EUV, DUV, e-beam and NIL
  • Spin-on glass dielectric
  • Advanced, low k dielectrics coatings
  • Optical coatings, refractive index range 1.2 – 2.0
  • Optically clear, UV-curable silicone adhesives for wafer-level optics and bonding
  • Process auxiliaries – strippers and removers

Patterning – Etching - Stripping Solutions

  • Comprehensive package of materials and processes to create advanced optical features on various substrates:

NIL resin + underlayer(s) + stripper solution

  • Extensive etch selectivity library for high aspect ratio pattern transfer
  • Substrate compatible stripper solution for an easy and clean strip of the residual layers

Visit PiBond at Booth no. 4117 (Hall F) at Finland Pavilion with Photonics Finland.

Booth location